Semiconductor Advanced Packaging
Produktnummer:
18d5f57d631f7741dabd973a6b0e0699bb
| Autor: | Lau, John H. |
|---|---|
| Themengebiete: | 2D, 2.1D, 2.3D, 2.5D, and 3D IC Integration Fan-in Wafer/Panel-Level Chip-Scale Package Fan-out Wafer/Panel-Level Packaging Flip Chip Technology Heterogenenous Chiplets Integration High Bandwidth Memeory System-in-Package Thermocompression Bonding and Chip-to-Wafer Bonding Through-silicon Vias and Redistribution-Layers Wafer-to-Wafer Bondind and Hybrid Bonding |
| Veröffentlichungsdatum: | 18.05.2021 |
| EAN: | 9789811613753 |
| Sprache: | Englisch |
| Seitenzahl: | 498 |
| Produktart: | Gebunden |
| Verlag: | Springer Singapore |
Produktinformationen "Semiconductor Advanced Packaging"
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
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