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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
192,59 €*
Preise inkl. MwSt. zzgl. Versandkosten
Neu
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
181,89 €*
Preise inkl. MwSt. zzgl. Versandkosten
Analysis of process-induced distortions and residual stresses of composite structures
52,00 €*
Preise inkl. MwSt. zzgl. Versandkosten