Zu "Through Silicon Via" wurden 6 Produkte gefunden
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Copper Electrodeposition for Nanofabrication of Electronics Devices
85,59 €*
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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
117,69 €*
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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
160,49 €*
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Copper Electrodeposition for Nanofabrication of Electronics Devices
106,99 €*
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Arbitrary Modeling of TSVs for 3D Integrated Circuits
106,99 €*
Preise inkl. MwSt. zzgl. Versandkosten
Arbitrary Modeling of TSVs for 3D Integrated Circuits
106,99 €*
Preise inkl. MwSt. zzgl. Versandkosten