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World Congress on Medical Physics and Biomedical Engineering September 7 - 12, 2009 Munich, Germany

213,99 €*

Sofort verfügbar, Lieferzeit: 1-3 Tage

Produktnummer: 1853d5823b6f3e4ee2a797d9c2a679f75b
Themengebiete: Biomaterial Clinical Engineering E-Health Medical Physics Tissue Engineering biological effects biomechanics biomedical engineering image processing imaging
Veröffentlichungsdatum: 28.09.2009
EAN: 9783642038907
Sprache: Englisch
Seitenzahl: 354
Produktart: Kartoniert / Broschiert
Herausgeber: Dössel, Olaf Schlegel, Wolfgang C.
Verlag: Springer Berlin
Untertitel: Vol. 25/XI Biomedical Engineering for Audiology, Ophthalmology, Emergency and Dental Medicine
Produktinformationen "World Congress on Medical Physics and Biomedical Engineering September 7 - 12, 2009 Munich, Germany"
Present Your Research to the World! The World Congress 2009 on Medical Physics and Biomedical Engineering – the triennial scientific meeting of the IUPESM - is the world’s leading forum for presenting the results of current scientific work in health-related physics and technologies to an international audience. With more than 2,800 presentations it will be the biggest conference in the fields of Medical Physics and Biomedical Engineering in 2009! Medical physics, biomedical engineering and bioengineering have been driving forces of innovation and progress in medicine and healthcare over the past two decades. As new key technologies arise with significant potential to open new options in diagnostics and therapeutics, it is a multidisciplinary task to evaluate their benefit for medicine and healthcare with respect to the quality of performance and therapeutic output. Covering key aspects such as information and communication technologies, micro- and nanosystems, optics and biotechnology, the congress will serve as an inter- and multidisciplinary platform that brings together people from basic research, R&D, industry and medical application to discuss these issues. As a major event for science, medicine and technology the congress provides a comprehensive overview and in–depth, first-hand information on new developments, advanced technologies and current and future applications. With this Final Program we would like to give you an overview of the dimension of the congress and invite you to join us in Munich! Olaf Dössel Congress President Wolfgang C.

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