Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Produktnummer:
18c73a285da1734cd39d9835fb8a00a0ef
| Autor: | Lau, John H. |
|---|---|
| Themengebiete: | Bridge Co-packaged optics Fan-in wafer-level package Fan-out wafer-level package Flip chip Hybrid bonding Hybrid substrate Near-package optics On-boardoptics Silicon photonics |
| Veröffentlichungsdatum: | 24.05.2024 |
| EAN: | 9789819721399 |
| Sprache: | Englisch |
| Seitenzahl: | 501 |
| Produktart: | Gebunden |
| Verlag: | Springer Singapore |
Produktinformationen "Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology"
This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics.The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.
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