Electrical Conductive Adhesives with Nanotechnologies
Produktnummer:
1846fbad476acf470a947a9958488ddb02
| Autor: | Li, Yi (Grace) Lu, Daniel Wong, C.P. |
|---|---|
| Themengebiete: | electrical conductive adhesives electronic devices electronic packaging integrated circuit lead-free solder nano techniques nanotechnology |
| Veröffentlichungsdatum: | 16.10.2009 |
| EAN: | 9780387887821 |
| Sprache: | Englisch |
| Seitenzahl: | 437 |
| Produktart: | Gebunden |
| Verlag: | Springer US |
Produktinformationen "Electrical Conductive Adhesives with Nanotechnologies"
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
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