Assembly and Reliability of Lead-Free Solder Joints
Produktnummer:
18e2e8e22410c54138a8a68b6c945a3596
| Autor: | Lau, John H. Lee, Ning-Cheng |
|---|---|
| Themengebiete: | Advanced specialty flux designs Design for reliability Failure analysis Prevailing lead-free materials Reliability testing and data analysis Soldering processes Solder joint characterizations |
| Veröffentlichungsdatum: | 30.05.2021 |
| EAN: | 9789811539220 |
| Sprache: | Englisch |
| Seitenzahl: | 527 |
| Produktart: | Kartoniert / Broschiert |
| Verlag: | Springer Singapore |
Produktinformationen "Assembly and Reliability of Lead-Free Solder Joints"
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
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